About the Role
The Packaging Engineer will be responsible for designing and developing packaging solutions for ASIC/SoC projects. The role involves selecting appropriate packaging technologies, creating package layouts, and performing simulations to ensure package reliability and performance. The ideal candidate should have strong problem-solving skills and the ability to collaborate with IC design teams and package assembly vendors.
Requirements
B.E./B.Tech or M.E./M.Tech in Electronics/Electrical/Mechanical Engineering or related field. 4+ years of experience in IC packaging design and development. Knowledge of various packaging technologies, such as wire bonding, flip-chip, and 3D packaging. Familiarity with packaging design tools, such as Cadence Allegro or Mentor Graphics Xpedition. Understanding of thermal and mechanical aspects of IC packaging.
About the Company
Semiconductor Jobs India is a leading online recruitment platform dedicated to serving the semiconductor industry in India. Our mission is to bridge the gap between talented professionals and top semiconductor companies, facilitating mutually beneficial connections and driving the growth of the industry.